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CH340-USBC.kicad_pcb
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CH340-USBC.kicad_pcb
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(kicad_pcb (version 20201116) (generator pcbnew)
(general
(thickness 1.6)
)
(paper "A4")
(layers
(0 "F.Cu" signal)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
(50 "User.1" user)
(51 "User.2" user)
(52 "User.3" user)
(53 "User.4" user)
(54 "User.5" user)
(55 "User.6" user)
(56 "User.7" user)
(57 "User.8" user)
(58 "User.9" user)
)
(setup
(stackup
(layer "F.SilkS" (type "Top Silk Screen"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen"))
(copper_finish "None")
(dielectric_constraints no)
)
(grid_origin 84 76)
(pcbplotparams
(layerselection 0x00010fc_ffffffff)
(disableapertmacros false)
(usegerberextensions false)
(usegerberattributes true)
(usegerberadvancedattributes true)
(creategerberjobfile true)
(svguseinch false)
(svgprecision 6)
(excludeedgelayer true)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin true)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue true)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk false)
(outputformat 1)
(mirror false)
(drillshape 0)
(scaleselection 1)
(outputdirectory "gerber/")
)
)
(net 0 "")
(net 1 "Net-(C1-Pad2)")
(net 2 "/VCC")
(net 3 "/DTR")
(net 4 "GND")
(net 5 "Net-(F1-Pad1)")
(net 6 "/3V3")
(net 7 "Net-(D1-Pad2)")
(net 8 "Net-(D2-Pad2)")
(net 9 "/TXD")
(net 10 "Net-(D3-Pad2)")
(net 11 "/RXD")
(net 12 "no_connect_21")
(net 13 "/CC1")
(net 14 "/USBD-")
(net 15 "/USBD+")
(net 16 "no_connect_20")
(net 17 "/CC2")
(net 18 "/#VCC")
(net 19 "/#DTR")
(net 20 "/RTS")
(net 21 "no_connect_25")
(net 22 "no_connect_24")
(net 23 "no_connect_23")
(net 24 "no_connect_22")
(net 25 "no_connect_27")
(net 26 "no_connect_26")
(net 27 "no_connect_19")
(footprint "Connector_USB:USB_C_Receptacle_HRO_TYPE-C-31-M-12" (layer "F.Cu")
(tedit 5D3C0721) (tstamp 03e9995c-33a3-4730-aa57-86e589c0578b)
(at 88.2 86 -90)
(descr "USB Type-C receptacle for USB 2.0 and PD, http://www.krhro.com/uploads/soft/180320/1-1P320120243.pdf")
(tags "usb usb-c 2.0 pd")
(property "图框名称" "")
(property "图框文件" "CH340-USBC.kicad_sch")
(path "/f290f052-8527-4645-b8cc-097645cca67a")
(attr smd)
(fp_text reference "J1" (at -0.1 0 90) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp ad766fb6-2236-4844-8f5d-e0123500e73b)
)
(fp_text value "USB_C_Receptacle_USB2.0" (at 0 5.1 90) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 804233d9-ddba-4521-999f-72e11fe3fa12)
)
(fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp ac7395a6-74dd-47da-a43a-c8beb913431b)
)
(fp_line (start 4.7 2) (end 4.7 3.9) (layer "F.SilkS") (width 0.12) (tstamp 162eca10-1f65-40d8-a137-5c9be7ea0b99))
(fp_line (start -4.7 3.9) (end 4.7 3.9) (layer "F.SilkS") (width 0.12) (tstamp 5a8bac4f-070f-4014-9d48-704f1efdadfd))
(fp_line (start -4.7 2) (end -4.7 3.9) (layer "F.SilkS") (width 0.12) (tstamp 6668a9a8-1502-4779-a06e-c15f89806e1e))
(fp_line (start 4.7 -1.9) (end 4.7 0.1) (layer "F.SilkS") (width 0.12) (tstamp 6cc5c2a8-283c-4060-bc07-4c78014cc318))
(fp_line (start -4.7 -1.9) (end -4.7 0.1) (layer "F.SilkS") (width 0.12) (tstamp b8498be4-ea84-495c-b75a-d8cf20b91d7b))
(fp_line (start -5.32 -5.27) (end 5.32 -5.27) (layer "F.CrtYd") (width 0.05) (tstamp 395ebeaa-3bd0-4232-a11a-3fc7ba3a32fd))
(fp_line (start -5.32 4.15) (end 5.32 4.15) (layer "F.CrtYd") (width 0.05) (tstamp 5010e7bb-c452-4024-bb09-4201b654fa5f))
(fp_line (start -5.32 -5.27) (end -5.32 4.15) (layer "F.CrtYd") (width 0.05) (tstamp 77406e55-ca2b-4ded-9344-4b650bfcb690))
(fp_line (start 5.32 -5.27) (end 5.32 4.15) (layer "F.CrtYd") (width 0.05) (tstamp b1a771a0-c568-4e9e-839e-3676bbcbf048))
(fp_line (start -4.47 3.65) (end 4.47 3.65) (layer "F.Fab") (width 0.1) (tstamp 0b6b6cdb-aff6-4b08-b5c3-b4597259a497))
(fp_line (start -4.47 -3.65) (end -4.47 3.65) (layer "F.Fab") (width 0.1) (tstamp 3fbd3d01-6b34-403b-8b87-1b4c2c5d9fd4))
(fp_line (start -4.47 -3.65) (end 4.47 -3.65) (layer "F.Fab") (width 0.1) (tstamp 540002b4-5304-4e25-a3dc-6fbd73642d8e))
(fp_line (start 4.47 -3.65) (end 4.47 3.65) (layer "F.Fab") (width 0.1) (tstamp 8aabef7d-a5a7-46ca-be46-a1b12e4bd9f0))
(pad "" np_thru_hole circle (at -2.89 -2.6 270) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask) (tstamp 5237d3ad-8bbc-46b9-a22e-5b155c13f7e6))
(pad "" np_thru_hole circle (at 2.89 -2.6 270) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask) (tstamp 7eca7bb1-8d86-4cea-b9da-8fc2400f9a2b))
(pad "A1" smd rect (at -3.25 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 4 "GND") (pinfunction "GND") (tstamp 7a30281a-2adf-40c6-a79f-4c5844f54c47))
(pad "A4" smd rect (at -2.45 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 5 "Net-(F1-Pad1)") (pinfunction "VBUS") (tstamp 5ea4c24c-4cc9-41e6-9b24-eae69969ac95))
(pad "A5" smd rect (at -1.25 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 13 "/CC1") (pinfunction "CC1") (tstamp a6f8b6f9-2608-4159-b0b7-02d54f3b2814))
(pad "A6" smd rect (at -0.25 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 15 "/USBD+") (pinfunction "D+") (tstamp 2ebed932-1a2e-461d-afd2-1119231c7466))
(pad "A7" smd rect (at 0.25 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 14 "/USBD-") (pinfunction "D-") (tstamp a3c994fc-53c4-4371-bbaa-d1416794183e))
(pad "A8" smd rect (at 1.25 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 27 "no_connect_19") (pinfunction "SBU1") (tstamp 220eea09-ed9b-41b3-875f-b2f5c76ff3ce))
(pad "A9" smd rect (at 2.45 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 5 "Net-(F1-Pad1)") (pinfunction "VBUS") (tstamp 3f37c6d6-9b85-4264-b45b-8dcbd157176a))
(pad "A12" smd rect (at 3.25 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 4 "GND") (pinfunction "GND") (tstamp 65b01f17-90fe-4778-a3e8-fc0f281d77e7))
(pad "B1" smd rect (at 3.25 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 4 "GND") (pinfunction "GND") (tstamp ec3d6049-638a-4833-861b-62c2dc4282cb))
(pad "B4" smd rect (at 2.45 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 5 "Net-(F1-Pad1)") (pinfunction "VBUS") (tstamp 69b03d2c-8044-452b-a529-445c4f72de43))
(pad "B5" smd rect (at 1.75 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 17 "/CC2") (pinfunction "CC2") (tstamp ceec39be-6a07-4d80-81b9-99d3433cac92))
(pad "B6" smd rect (at 0.75 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 15 "/USBD+") (pinfunction "D+") (tstamp a1eabc83-1930-4ea6-9f3e-2213ca0aa880))
(pad "B7" smd rect (at -0.75 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 14 "/USBD-") (pinfunction "D-") (tstamp 94922af8-b67e-488f-94b5-af0c0a3b2a53))
(pad "B8" smd rect (at -1.75 -4.045 270) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 16 "no_connect_20") (pinfunction "SBU2") (tstamp deac40ae-2f23-4a1b-b4c1-0d9eb7b77897))
(pad "B9" smd rect (at -2.45 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 5 "Net-(F1-Pad1)") (pinfunction "VBUS") (tstamp 613b9aab-b7e2-44a8-947f-da89363df8d4))
(pad "B12" smd rect (at -3.25 -4.045 270) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask")
(net 4 "GND") (pinfunction "GND") (tstamp ee7e9fb4-18e4-4950-8f44-21d1e1ad0318))
(pad "S1" thru_hole oval (at -4.32 1.05 270) (size 1 1.6) (drill oval 0.6 1.2) (layers *.Cu *.Mask)
(net 4 "GND") (pinfunction "SHIELD") (tstamp 1ea8568f-4358-4c89-8712-9797ec9b09b1))
(pad "S1" thru_hole oval (at -4.32 -3.13 270) (size 1 2.1) (drill oval 0.6 1.7) (layers *.Cu *.Mask)
(net 4 "GND") (pinfunction "SHIELD") (tstamp 7bc86ed5-0486-4f8c-81c5-1835a51c159d))
(pad "S1" thru_hole oval (at 4.32 -3.13 270) (size 1 2.1) (drill oval 0.6 1.7) (layers *.Cu *.Mask)
(net 4 "GND") (pinfunction "SHIELD") (tstamp 9486915b-ac56-4b73-8994-e3ea37c9fc1d))
(pad "S1" thru_hole oval (at 4.32 1.05 270) (size 1 1.6) (drill oval 0.6 1.2) (layers *.Cu *.Mask)
(net 4 "GND") (pinfunction "SHIELD") (tstamp b5beab41-d6db-4416-9063-7ec7c9b962f0))
(model "${KISYS3DMOD}/Connector_USB.3dshapes/USB_C_Receptacle_HRO_TYPE-C-31-M-12.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(footprint "Capacitor_SMD:C_0805_2012Metric" (layer "F.Cu")
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